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all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 1 of 27 www.diodes.com suggested pad layout ? diodes incorporated suggested pad layout based on ipc-7351a x1-dfn1006-2 / x2-dfn1006-2 / minimelf / melf / sod323 / sod123 / sod523 / sma / smb / smc dimensions x1-dfn1006-2 / x2-dfn1006-2 minimelf melf sod123 sod323 sod523 sma smb smc z 1.1 4.7 6.3 4.9 3.75 2.3 6.5 6.8 9.4 g 0.3 2.1 3.3 2.5 1.05 1.1 1.5 1.8 4.4 x 0.7 1.7 2.7 0.7 0.65 0.8 1.7 2.3 3.3 y 0.4 1.3 1.5 1.2 1.35 0.6 2.5 2.5 2.5 c 0.7 3.5 4.8 3.7 2.40 1.7 4.0 4.3 6.8 x3-dfn0603-2 X2-DFN0806-3 dimensions value (in mm) c 0.355 x 0.230 y 0.300 z 0.610 dimensions value (in mm) c 0.350 x 0.200 x1 0.450 x2 0.550 y 0.375 y1 0.475 y2 1.000 z x c g y z y (2x) x (2x) c x1 x2 y2 y1 y (2x) x (2x) c
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 2 of 27 www.diodes.com suggested pad layout ? diodes incorporated x1-dfn1006-3 / x2-dfn1006-3 dimensions value (in mm) z 1.1 g1 0.3 g2 0.2 x 0.7 x1 0.25 y 0.4 c 0.7 x2-dfn1010-6 dimensions value (in mm) c 0.350 g 0.150 x 0.200 x1 0.900 y 0.550 y1 1.250 x1-dfn1212-3 x1-dfn1212-3 type b dimensions value (in mm) c 0.80 x 0.42 x1 0.32 y 0.50 y1 0.50 y2 1.50 dimensions value (in mm) c 0.80 x 0.42 x1 0.32 x2 0.90 y 0.50 y1 0.50 y2 0.20 y3 1.50 y c g1 g2 x x 1 z 1 y1 x1 x(6x) y (6x) g(4x) c y2 x x1 (2x) y y1 (2x) c y3 x x1(2x) y y1 (2x) c y2 x2
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 3 of 27 www.diodes.com suggested pad layout ? diodes incorporated x2-dfn1410-6 dimensions value (in mm) c 0.500 g 0.250 x 0.250 x1 1.250 y 0.525 y1 1.250 x1-dfn1411-3 dimensions value (in mm) z 1.38 g1 0.15 g2 0.15 x 0.95 x1 0.75 x2 0.40 y 0.75 c 0.76 x1-dfn1612-6 / x2-dfn1310-6 dimensions x1-dfn1612-6 x2- dfn1310-6 g1 0.15 0.16 g2 0.175 0.17 g3 0.15 0.15 x1 0.60 0.52 x2 0.25 0.20 y1 0.65 0.52 y2 0.45 0.375 a 0.10 0.09 b 0.15 0.06 1 x1 y1 y(6x) x(6x) g(4x) c c y x1 z g1 x x2 g2 b g3 a g2 x2 y2 y1 g1 x1
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 4 of 27 www.diodes.com suggested pad layout ? diodes incorporated u-dfn1616-6 x1-dfn1616-6 type e dimensions value (in mm) z 1.3 g 0.175 x1 0.50 x2 0.525 y 0.30 c 0.50 dimensions value (in mm) c 0.500 x 0.300 x1 0.200 x2 0.720 x3 0.400 y 0.475 y1 0.620 y2 1.900 u-dfn1616-8 dimensions value (in mm) g1 0.15 g2 0.20 x1 0.65 x2 0.25 y1 1.25 y2 0.50 c 0.40 a 0.10 u-dfn2018-6 dimensions value (in mm) c 0.50 g 0.20 x 0.25 x1 1.60 y 0.35 y1 1.20 x1 g x2 z c y x (6x) c y (2x) y2 x1 y1 x2 x3 g1 y2 y1 c x1 x2 g2 a y xc x1 g y1
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 5 of 27 www.diodes.com suggested pad layout ? diodes incorporated u-dfn2020-3 dimensions value (in mm) dimensions value (in mm) c 1.00 y1 0.60 g 0.15 y2 0.45 x 1.40 y3 0.45 x1 0.35 y4 0.698 x2 0.45 y5 0.313 x3 0.322 r1 0.225 x4 0.60 r2 0.05 y 1.10 r3 0.20 u-dfn2020-6 dimensions value (in mm) c 0.650 x 0.350 x1 1.650 x2 1.700 y 0.525 y1 1.010 y2 2.400 x2-dfn2020-6 dimensions value (in mm) c 0.650 x 0.400 x1 1.050 x2 1.700 y 0.500 y1 1.600 y2 1.600 y3 2.300 x1 c x3 x y4 y1 x2 y y2 y3 r3 r2 r1 g x4 y5 y2 x1 x2 y1 y (6x) x (6 x) c x (6x) c y2 y1 y y3 x2 x1
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 6 of 27 www.diodes.com suggested pad layout ? diodes incorporated u-dfn2020-3 type b u-dfn2020-6 dimensions value (in mm) c 1.30 g 0.24 x 0.35 x1 1.52 y 1.09 y1 0.47 y2 0.50 dimensions value (in mm) z 1.67 g 0.15 x1 0.90 x2 0.45 y 0.37 c 0.65 u-dfn2020-6 type b u-dfn2020-6 type e dimensions value (in mm) z 1.67 g 0.20 g1 0.40 x1 1.0 x2 0.45 y 0.37 y1 0.70 c 0.65 dimensions value (in mm) c 0.650 x 0.400 x1 0.285 x2 1.050 y 0.500 y1 0.920 y2 1.600 y3 2.300 u-dfn2510-8 u-dfn2523-6 dimensions value (in mm) c 0.5 c1 1.0 g 0.2 x 0.2 x1 0.4 y 0.6 y1 1.4 dimensions value (in mm) c 0.650 x 0.400 x1 1.700 y 0.650 y1 0.450 y2 1.830 y3 2.700 x y1 y y2 x1 c g g g yc z y x2 x1 g g y c z y1 x2 x1 g1 x1 y3 x (6x) c x2 y1 y2 y (2x) y1 x1 c x g c1 y x1 y1 x y3 y2 y c
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 7 of 27 www.diodes.com suggested pad layout ? diodes incorporated u-dfn2626-10 dimensions value (in mm) c 0.500 x 0.300 x1 2.250 x2 2.300 y 0.600 y1 1.360 y2 3.000 u-dfn3016-12 dimensions value (in mm) c 0.500 x 0.300 x1 2.800 x2 2.250 y 0.600 y1 0.450 y2 2.050 w-dfn3020-8 type b dimensions value (in mm) c 0.650 g 0.285 g1 0.090 x 0.400 x1 1.120 y 0.730 y1 0.500 y2 0.365 pin1 x2 y2 c x y y1 x1 y2 y1 x1 x2 y (12x) cx (12x) c x1 g1 x y1 y y2 g
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 8 of 27 www.diodes.com suggested pad layout ? diodes incorporated w-dfn3020-8 type k dimensions v alue (in mm) c 0.650 x 0.600 x 1 0.400 x 2 0.825 x 3 0.675 x 4 1.250 x 5 2.750 y 0.675 y 1 0.550 y 2 0.850 y 3 0.755 y 4 1.455 y 5 1.000 y 6 0.650 y 7 1.455 y 8 2.300 u-dfn3020-8 type e dimensions value (in mm) c 0.650 g 0.200 g1 0.150 x 0.400 x1 1.100 x2 1.100 y 0.550 y1 0.900 y2 0.900 y3 2.300 c x (8x) y (8x) x1 y1 x2 y2 g g1 y3 x1 (6x) y1 y (4x) y3 x2 y7 y6 x4 x3 y5 y4 x (2x) c y2 y8 x5
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 9 of 27 www.diodes.com suggested pad layout ? diodes incorporated u-dfn3020-8 type m dimensions value (in mm) c 0.650 x 0.400 x1 0.600 x2 1.320 x3 1.200 x4 0.200 x5 2.750 y 0.750 y1 0.550 y2 0.680 y3 0.450 y4 0.430 y5 2.400 y6 0.250 u-dfn3020-10 dimensions value (in mm) c 0.650 g 0.150 g1 0.600 x 0.300 x1 0.350 x2 2.800 y 0.500 y1 1.000 y2 2.300 u-dfn3030-4 u-dfn3030-8 dimensions value (in mm) c 1.300 g1 0.100 g2 0.150 g3 0.830 g4 0.115 g5 0.135 g6 0.170 g7 0.500 g8 0.500 r 0.150 x 0.500 x1 1.375 x2 1.225 x3 1.175 y 1.980 y1 1.015 y2 0.715 y3 0.650 dimensions value (in mm) z 2.59 g 0.11 x1 2.49 x2 0.65 y 0.39 c 0.65 pin1 x (8x) c x5 y3 y4 y6 y (4x) y5 y1 (2x) x3 x2 x4 y2 x1 (2x) x2 y2 c x y x1 y1 g g1 y x (4x) c y3 (2x) y2 y1 g1 g3 g4 r g7 g8 x3 g5 x1 x2 g2 g6 z g x1 x2 yc
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 10 of 27 www.diodes.com suggested pad layout ? diodes incorporated u-dfn3030-8 type e dimensions value (in mm) c 0.65 c1 2.35 x 0.30 y 0.65 y1 1.60 y2 2.75 u-dfn3030-10 u-dfn3030-12 dimensions value (in mm) z 2.60 g 0.15 x 1.80 x1 0.60 y 0.30 c 0.50 dimensions value (in mm) z 2.60 g 0.15 x 1.80 x1 0.60 y 0.28 c 0.45 u-dfn3030-14 dimensions value (in mm) c 0.400 x 0.250 x1 2.350 x2 2.650 y 0.600 y1 1.750 y2 3.400 y (x8) x (x8) c c1 y1 y2 c y z x x1 g g c y z x x1 g g pin1 x2 x1 y1 c x (14x) y2 y (14x)
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 11 of 27 www.diodes.com suggested pad layout ? diodes incorporated u-dfn4030-12 dimensions value (in mm) c 0.500 x 0.300 x1 2.800 x2 3.350 y 0.600 y1 1.750 y2 3.400 u-dfn4030-12 type b dimensions value (in mm) c 0.500 x 0.350 x1 1.160 x2 0.900 x3 1.720 x4 0.850 x5 3.700 y 0.700 y1 0.870 y2 0.500 y3 0.550 y4 0.350 y5 1.710 y6 0.940 y7 3.300 pin1 c x (12x) y1 y2 y (12x) x2 x1 y7 x5 c x (12x) y5 (2x) x1(2x) x3 (2x) y y3 x2 y6 y2 y4 x4 1 y1
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 12 of 27 www.diodes.com suggested pad layout ? diodes incorporated u-dfn4030-12 type c dfn322 dimensions value (in mm) c 0.500 g 0.225 x 0.300 x1 0.800 x2 0.890 x3 0.990 x4 1.150 x5 3.590 y 0.600 y1 0.600 y2 0.440 y3 1.030 y4 1.750 y5 3.400 y6 0.275 dimensions value (in mm) c 0.65 g 0.20 x 0.35 x1 1.52 y 0.55 y1 0.98 y2 0.47 y3 0.63 y4 2.20 w-dfn5020-6 w-dfn5060-4 dimensions value (in mm) c 0.50 g 0.35 x 0.35 x1 0.90 x2 1.80 y 0.70 y2 1.60 y3 3.20 dimensions value (in mm) c 4.00 x 0.75 y 0.95 y1 6.20 z 4.75 df-s / minidip msop-8 dimensions df-s minidip z 10.26 6.91 x 1.2 0.60 y 1.52 0.76 c 5.2 2.67 dimensions value (in mm) c 0.650 x 0.450 y 1.350 y1 5.300 x3 y2 y6 g 1 y4 y y5 x (12x) y3 x4 x5 x1 x2 y1 (6x) c x1 y3 y1 y (2x) x (3x) cc y2 y4 g y3 x2 x1 y2 xc y g y1 y (4x) x (4x) c z x c y z x c y y1
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 13 of 27 www.diodes.com suggested pad layout ? diodes incorporated msop8-ep msop-10 dimensions value (in mm) c 0.650 g 0.450 x 0.450 x1 2.000 y 1.350 y1 1.700 y2 5.300 dimensions value (in mm) x 0.30 y 1.4 c1 4.4 c2 0.50 powerdi ? 5 powerdi ? 123 / powerdi ? 323 dimensions value (in mm) c 1.840 g 0.852 x 3.360 x1 1.390 y 4.860 y1 1.400 dimensions powerdi ? 123 powerdi ? 323 g 1.0 0.5 x1 2.2 2.0 x2 0.9 0.8 y1 1.4 0.8 y2 1.4 1.1 powerdi ? 123 type b dimensions value (in mm) g 2.000 x 1.050 x1 4.100 y 1.500 g x c y y2 y1 x1 x y c1 c2 g x c y1 (2x) y x1 (2x) x1 gx2 y2 y1 x y x1 g
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 14 of 27 www.diodes.com suggested pad layout ? diodes incorporated powerdi ? 3333-8 powerdi ? 3333-8 type b dimensions value (in mm) c 0.650 g 0.230 g1 0.420 y 3.700 y1 2.250 y2 1.850 y3 0.700 x 2.370 x2 0.420 dimensions value (in mm) c 0.650 g 0.230 x 0.420 x1 2.370 x2 0.420 x3 1.890 x4 2.710 y 0.700 y1 0.400 y2 1.160 y3 1.850 y4 0.405 y5 1.295 y6 3.700 x y y1 y3 y2 x2 c 14 85 g g1 x1 y6 y2 y (5x) y3 x (5x) c g x2 (3x) x3 y5 x4 y4 y1
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 15 of 27 www.diodes.com suggested pad layout ? diodes incorporated powerdi ? 5060-8 powerdi ? 5060-8 type b dimensions value (in mm) c 1.270 g 0.660 g1 0.820 x 4.420 x1 4.100 x2 0.610 y 6.610 y1 3.810 y2 1.020 y3 1.270 dimensions value (in mm) c 1.270 x 0.610 x1 4.420 y 0.910 y1 0.910 y2 0.895 y3 2.130 y4 0.585 y5 2.550 y6 6.550 powerdi ? 3030-8 dimensions v alue (in mm) c 0.650 x 0.400 y 0.850 y 1 3.400 x x1 y y1 y2 g1 y3 (4x) x2 (8x) g c y 6 x 1 c x y 5 y 2 y 3 y 1 y 5 x y 4 y1 c x (8x) y (8x)
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 16 of 27 www.diodes.com suggested pad layout ? diodes incorporated qsop-16 dimensions value (in mm) c 0.635 x 0.350 x1 4.795 y 1.450 y1 6.400 qsop-20 dimensions value (in mm) c 0.635 x 0.350 x1 6.065 y 1.450 y1 6.400 sm-8 so-8 dimensions value (in mm) c 1.52 c1 4.6 x 0.95 y 2.80 y1 6.80 dimensions value (in mm) x 0.60 y 1.55 c1 5.4 c2 1.27 y x1 y 16x x 16x c 1 1 y 1 x 1 y 2 0 x c x 2 0 x y1 y (8x) x (8x) c c1 x c1 c2 y
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 17 of 27 www.diodes.com suggested pad layout ? diodes incorporated sod323f dimensions value (in mm) x 0.710 x1 2.700 y 0.403 sop-14 dimensions value (in mm) x 0.60 y 1.50 c1 5.4 c2 1.27 sop-16 dimensions value (in mm) c 1.270 x 0.670 x1 9.560 y 1.450 y1 6.400 x1 y (2x) x (2x) x c1 c2 y ? x1 y1 1 c x (16x) y(16x)
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 18 of 27 www.diodes.com suggested pad layout ? diodes incorporated sot143 sot223 dimensions value (in mm) z 2.70 g 1.30 x 2.50 x1 1.0 x2 0.60 y 0.70 c 2.0 dimensions value (in mm) x1 3.3 x2 1.2 y1 1.6 y2 1.6 c1 6.4 c2 2.3 sot523 / sot323 / sot23 / sc59 dimensions sot523 sot323 sot23 sc59 z 1.8 2.8 2.9 3.4 x 0.4 0.7 0.8 0.8 y 0.51 0.9 0.9 1.0 c 1.3 1.9 2.0 2.4 e 0.7 1.0 1.35 1.35 sot23f dimensions value (in mm) c 0.95 x 0.60 y 0.80 y1 1.80 x1 x2 g z y c x x2 x2 c1 c2 x1 y2 y1 x e y c z c y1 y (3x) x (3x)
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 19 of 27 www.diodes.com suggested pad layout ? diodes incorporated sc74r / sot26 / sot363 / sot563 sot25 / sot353 / sot553 dimensions sc74r / sot26 sot363 sot563 z 3.20 2.5 2.2 g 1.60 1.3 1.2 x 0.55 0.42 0.375 y 0.80 0.6 0.5 c1 2.40 1.9 1.7 c2 0.95 0.65 0.5 dimensions sot25 sot353 sot553 z 3.20 2.5 2.2 g 1.60 1.3 1.2 x 0.55 0.42 0.375 y 0.80 0.6 0.5 c1 2.40 1.9 1.7 c2 0.95 0.65 0.5 sot666 dimensions value (in mm) c 0.50 g 0.80 x 0.35 y 0.50 sot953 dimensions value (in mm) c 0.350 x 0.200 y 0.200 y1 1.100 x z y c1 c2 c2 g x z y c1 c2 c2 g x (6x) y (6x) c g y1 y (5x) c c x (5x)
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 20 of 27 www.diodes.com suggested pad layout ? diodes incorporated sot963 dimensions value (in mm) c 0.350 x 0.200 y 0.200 y1 1.100 sot89-3 sot89-5 dimensions value (in mm) x 0.900 x1 1.733 x2 0.416 y 1.300 y1 4.600 y2 1.475 y3 0.950 y4 1.125 c 1.500 dimensions value (in mm) x1 1.7 x2 0.55 x3 0.4 y1 4.6 y2 1.2 y3 0.5 y4 1.1 c 3.0 to252 (dpak) dimensions value (in mm) z 11.6 x1 1.5 x2 7.0 y1 2.5 y2 7.0 c 6.9 e1 2.3 to263 (d 2 pak) dimensions value (in mm) c 5.08 x 1.10 x1 10.41 y 3.50 y1 7.01 y2 15.99 y1 y (6x) c c x (6x) y1 x1 y2 y c x (3x) y3 y4 x2 (2x) y1 x3 x1 y3 y2 x2 c y4 x2 c z x1 y1 e1 y2 x1 y y2 c x y1
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 21 of 27 www.diodes.com suggested pad layout ? diodes incorporated to252-4 dimensions value (in mm) c 1.27 c1 2.54 x 1.00 x1 5.73 y 2.00 y1 6.17 y2 1.64 y3 2.66 to252-5 to263-5 dimensions value (in mm) x 5.6 x1 0.6 y 11.0 y1 5.6 y2 2.0 c1 7.2 c2 1.27 dimensions value (in mm) x 10.9 x1 1.05 y 15.7 y1 9.1 y2 2.5 c 1.7 tsot25 dimensions value (in mm) c 0.950 x 0.700 y 1.000 y1 3.199 x1 y1 y2 y3 y x (4x) c c1 y2 y y1 x c 2 c1 x1 y2 y y1 x c x1 y1 c c x (5x) y (5x)
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 22 of 27 www.diodes.com suggested pad layout ? diodes incorporated tsot26 dimensions value (in mm) c 0.950 x 0.700 y 1.000 y1 3.199 tssop-14 dimensions value (in mm) x 0.45 y 1.45 c1 5.9 c2 0.65 tssop-16 dimensions value (in mm) c 0.650 x 0.350 x1 4.900 y 1.400 y1 6.800 y1 c c x (6x) y (6x) x c1 c2 y x1 y (16x) y1 x (16 x) 1 c
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 23 of 27 www.diodes.com suggested pad layout ? diodes incorporated tssop-16ep dimensions value (in mm) c 0.650 x 0.450 x1 3.290 x2 5.000 y 1.450 y1 3.290 y2 4.450 y3 7.350 tssop-20 dimensions value (in mm) c 0.650 x 0.420 x1 6.270 y 1.780 y1 4.160 y2 7.720 tssop-20ep dimensions value (in mm) c 0.650 x 0.420 x1 4.490 x2 6.270 y 1.780 y1 3.290 y2 4.160 y3 7.720 y2 y (16x) y3 c y1 x2 x1 x (16x) y1 y2 y (20x) x (20x) c x1 y1 x1 y2 y3 y (20x) x (20 x) c x2
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 24 of 27 www.diodes.com suggested pad layout ? diodes incorporated u-qfn3030-16 type b dimensions value (in mm) c 0.500 g 0.150 g1 0.150 x 0.350 x1 1.800 y 0.600 y1 1.800 u-qfn4040-16 type c dimensions value (in mm) c 0.650 x 0.400 x1 2.075 x2 0.550 x3 2.075 x4 4.400 y 0.650 y1 0.400 y2 1.225 y3 2.075 y4 0.550 y5 4.400 x (16x) y (16x) c y1 x1 g1 g 1 y2 y3 x3 y5 x1 c y (4x) x (8 x) x2 (8x) x4 y1 (8x) y4 (4x)
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 25 of 27 www.diodes.com suggested pad layout ? diodes incorporated u-qfn4040-20 dimensions value (in mm) c 0.500 x 0.350 x1 0.600 x2 2.500 x3 4.300 y 0.600 y1 0.350 y2 2.500 y3 4.300 x2-wlb0505-3 dimensions value (in mm) x 0.17 x1 0.50 y 0.22 y1 0.12 y2 0.50 1 y3 x3 y1(10x) x1(10 x) y2 x2 x(10 x) c y(10x) x1 y2 y y1 x x
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 26 of 27 www.diodes.com suggested pad layout ? diodes incorporated x2-wlb0808-4 dimensions value (in mm) c 0.40 d 0.20 u-wlb1010-4 dimensions value (in mm) c 0.50 d 0.25 u-wlb1510-6 dimensions value (in mm) c 0.50 c1 1.00 d 0.25 c c 4 x - ? d c c ?d c c1 c d
all dimensions are nominal values shown in millimeters note: the suggested land pattern dimensi ons have been provided for reference only, as actual pad layouts may vary depending on application. these numbers may be modified based on user equipment capability or fabrication criter ia. a more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ?z? dimension. for further information, please reference document ipc-7351a , naming convention for standard smt land patterns, and for international grid details, please see doc ument iec, publication 97. ap02001 rev. 52 27 of 27 www.diodes.com suggested pad layout ? diodes incorporated x2-wlb1818-4 dimensions value (in mm) c 0.65 d 0.30 x2-wlb2718-6 dimensions value (in mm) c 0.65 d 0.30 c a b 21 c d d 6 x c a b 21 c c c

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